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1. |
Rinse with 5% dilute sulphuric acid for activation before rhodium plating, then
D.I. rinse. |
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2. |
Nickel, gold or palladium nickel plate before rhodium plating is recommended for
better result. |
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3. |
Low rhodium content, low temperature and high acid content will slow down
deposition rate. |
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4. |
Avoid metallic contamination, use RHP-20 purifier when necessary to remove them. |
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5. |
Keep rhodium content within 10% range. |
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6. |
Low acid RD-A1 will not cause acid build-up, acid attack on anode is avoided. |
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7. |
Carbon filter cartridge should be used constantly to avoid organic
contamination. |
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8. |
1g/l rhodium is preferred when first make-up. |
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9. |
Rhodstar RD-A1 is highly compatible to most of common brand rhodium solution. |
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10. |
High grade sulphuric acid must be used in the Rh bath and acid rinse bath. |
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11. |
New plating equipment must be thoroughly cleaned before use. |
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12. |
Avoid partial overheating |
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13. |
Please wear mask, gloves, goggles to handle AS-1 and conc. sulphuric acid. |